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There are millions of chip models. It is Looks like a impossible challenge to understand their meaning. However, most chaotic things are controlled by a few laws, and the same is true for chip models.
NXP TI Naming Rule 1: A simple rule to understand most chip naming rules NXP TI
• The chip model is usually composed of three modules. The brand series is followed by parameters, as well as temperature, speed and packaging information. The packaging, lead-free information and packaging forms here are collectively called packaging information, and the three modules form a formula that can parse the naming of most chips.Today we use a simple rule to teach you how to understand most of the chip naming rules.
• We understand the last one (temperature, speed, packaging) as one part, because some brands may end with all three or only one of them, so here we assume it is a variable state. Don't think it's a bit complicated, just take a real case and you'll understand. Take this NXP model, MC is the prefix of Freescale (acquired by NXP), and 9S08AC is the family series of the product (Freescale's series) It corresponds to our first brand series, and its middle segment 60 represents 60KB of memory, parameter c represents temperature, FG represents package, and E represents lead-free. It corresponds to the third part, it’s not difficult, right?
• Does this rule only apply to NXP? Other brands may not necessarily be named this way. Then we will apply this rule to other brands to see if it also applies. Let’s take a look at this logic chip from TI.TMS is the prefix of TI. 320 is the series, which corresponds to the brand series. LF in the middle represents FLASH and voltage. 2407A is the device code. Does this part correspond to the parameters? PGE represents the package and A represents the temperature. This corresponds to what we have mentioned above. The end of the third part.
In addition to the above two brands, the same naming rule is also applicable to other brands. If you are interested in watching our next video (insert a small advertisement for ICONE here).
ST XILINS MICROCHIPS MAX
Why are the chip models so long? Is it deliberately difficult to purchase? Or is there another reason? Is there a method that allows you to crack most chip naming rules in 5 minutes? Most of the chip model naming rules we mentioned earlier have something in common.
• The chip model is usually composed of three modules. The brand series is followed by parameters, as well as temperature, speed and packaging information. The three modules form a formula that can resolve the naming of most chips.From this we can take a look at the ST model. STM32F is the signature prefix of ST brand products. 205 is the series. Here is the first part of the brand plus series. R represents the number of pins and E represents the memory 512kb. This part corresponds to In the middle of our parameters, T represents the LQFP package, and 6 represents the temperature, which corresponds to the third part. There are other special suffixes in the picture and text that represent the chip version and packaging, which correspond to our temperature, speed and packaging information.
• Does MICROCHIPS also comply with this naming rule? Let’s take a look at this model.PIC18F67J60T-I/PT: PIC18 F is a series prefix of Microchip, 67 represents memory, J60 represents the difference in multiple operating parameters, with or without T represents the difference in packaging, I represents temperature, and PT represents packaging.
• In addition to the main control chip, do some model naming rules of peripheral circuits also apply to this naming rule to understand? What I want to say is that it is possible, but the peripheral circuit does not have so many parameters to express, and the form is simpler. Take this MAX3486CPA: MAX is the prefix of the Maxim model, and the brand 3486 indicates the series. This series also includes its parameters, and C indicates the temperature. , PA means that the package corresponds to the last section.
