| MSD: |
| High Temperature Bake: |
| Tray: |
- Original content, please do not reprint.
Chip moisture will cause many use problems, including virtual soldering, chip failure, high-temperature soldering bursting, shortened service life, etc., so baking chips has become a more important job. Today we are going to discuss the choice of favorite potato chip baking equipment and how to control the baking time.
MSD:
MSD baking reference standards are common in the following several standards:
IPC/JEDEC J-STD-033 is the most commonly used reference standard for most integrated circuits.
High Temperature Bake:
The temperature is between 110° -125°, the specific baking time depends on the thickness of the part, assuming that it is to be baked at 110°, the thickness is equal to or less than 1.4mm between 8 and 16 hours, small or equal to 2mm is between 24-48 hours, and small or 4 mm is equal to 48 hours.
High temperature baking when there is a point to note is often ignored is the chip carrier, that is the tray tube, with the tape, if the temperature is too high, these materials will release unknown gas, will also affect the welding of components.
The Tray:
The trays can usually bake below 125°, but look closely at the baking temperature indicated on the tray.
The machine must not bake at temperatures higher than 60°C in cryogenic tray coils, tubes, and coils, otherwise the high temperature will damage the feed plate.
Before the paper/plastic bag/box, there is one more small detail that should not be overlooked.
The MSD for baking is valid for 48 hours, while the MSD only allows two bakes, so it's best to bake before going live.If the temperature is too high, or if the time is too long, it is easy to oxidize the device, or intermetallic compounds will form in the device, which will affect the solderability of the device.After baking, the environment is particularly dry, and static electricity is most likely to be generated. Please wear an anti-static wristband and gloves to take MSD.
