Intel

Cyclone® Field Programmable Gate Array (FPGA) IC 301 78336 4000 400-BGA

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® Field Programmable Gate Array (FPGA) IC 104 59904 2910 144-LQFP

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 13752320 220000 484-BFBGA

Summary of Intel Cyclone 10 GX Features

Technology

TSMC's 20-nm process technology

Packaging

• 1.0 mm ball-pitch FineLine BGA packaging

• 0.8 mm ball-pitch Ultra FineLine BGA packaging

• Multiple devices with identical package footprints for seamless migration between different FPGA densities

• RoHS6-compliance

High-performance FPGA fabric

• Enhanced 8-input ALM with four registers

• Improved multi-track routing architecture to reduce congestion and improve compilation time

• Hierarchical core clocking architecture

• Fine-grained partial reconfiguration

Internal memory blocks

• M20K—20-Kb memory blocks with hard error correction code (ECC), cascadable

• Memory logic array block (MLAB)—640-bit memory, cascadable

Embedded Hard IP blocks

Variable-precision DSP

• Native support for signal processing precision levels from 18 x 19 to 54 x 54, cascadable

• Native support for 27 x 27 multiplier mode

• 64-bit accumulator and cascade for systolic finite impulse responses (FIRs)

• Internal coefficient memory banks

• Preadder/subtractor for improved efficiency

• Additional pipeline register to increase performance and reduce power

• Supports floating point arithmetic:

   — Perform multiplication, addition, subtraction, multiply-add,

multiply-subtract, and complex multiplication.

   — Supports multiplication with accumulation capability, cascade

summation, and cascade subtraction capability.

   — Dynamic accumulator reset control.

   — Support direct vector dot and complex multiplication chaining multiply floating point DSP blocks.

Memory controller

DDR3, DDR3L, and LPDDR3

PCI Express®

PCI Express (PCIe®) Gen2 (x1, x2, or x4) and Gen1 (x1, x2, or x4) hard IP with complete protocol stack, endpoint, and root port.

Transceiver I/O

• PCS hard IPs that support:

   — 10 Gbps Ethernet (10GbE) (1)

   — PCIe PIPE interface

   — Interlaken

   — Gbps Ethernet (GbE)

   — 6G Common Public Radio Interface (CPRI) with deterministic latency support

   — Gigabit-capable passive optical network (GPON) with fast locktime support

• 12G Serial Digital Interface (SDI)

• 8B/10B, 64B/66B, 64B/67B encoders and decoders

• Custom mode support for proprietary protocols

Core clock networks

• Up to 300 MHz fabric clocking, depending on the application:

   — 467 MHz external memory interface clocking with 1,866 Mbps DDR3 interface

   — 300 MHz LVDS interface clocking with 1.434 Gbps LVDS interface

• Global, regional, and peripheral clock networks

• Clock networks that are not used can be gated to reduce dynamic power

Phase-locked loops(PLLs)

• High-resolution fractional synthesis PLLs:

   — Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

   — Support integer mode and fractional mode

   — Fractional mode support with third-order delta-sigma modulation

• Integer PLLs:

   — Adjacent to general purpose I/Os

   — Support external memory and LVDS interfaces

FPGA General-purpose I/Os (GPIOs)

• One 3 V I/O bank supporting up to 3.0 V I/O standards

• Up to 1.434 Gbps LVDS—every pair can be configured as receiver or transmitter

• On-chip termination (OCT)

• 1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfaces using LVDS I/O or 3 V I/O banks

External Memory Interface

• Hard memory controller—DDR3, DDR3L, and LPDDR3 support

• DDR3 speeds up to 933 MHz/1,866 Mbps

Low-power serial transceivers

• Continuous operating range up to 12.5 Gbps

• Backplane support up to 6.6 Gbps

• Extended range down to 125 Mbps with oversampling

• ATX transmit PLLs with user-configurable fractional synthesis capability

• Transmitter pre-emphasis and de-emphasis

• Dynamic reconfiguration of individual transceiver channels

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced 256-bit advanced encryption standard (AES) design security with authentication

• Configuration via protocol (CvP) using PCIe Gen1 or Gen2

• Dynamic reconfiguration of the transceivers and PLLs

• Fine-grained partial reconfiguration of the core fabric

• Active Serial ×4 Interface

Power management

• Programmable Power Technology

• Intel Quartus® Prime Pro Edition integrated power analysis tool

Software and tools

• Intel Quartus Prime Pro Edition design suite

• Transceiver toolkit

• Platform Designer (Standard) system integration tool

• DSP Builder advanced blockset

• OpenCL* support

Chip Altera Cyclone naming rules，Chinese chip Will replace it

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