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Enpirion® Converter, DDR Voltage Regulator IC 1 Output 16-QFN (3x3)
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5885
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16-UFQFN Exposed Pad
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Arria V GZ Field Programmable Gate Array (FPGA) IC 534 40249344 450000 1152-BBGA, FCBGA
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8685
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1152-BBGA, FCBGA
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Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 240-BFQFP Introduction The Cyclone® field programmable gate array family is based on a 1.5-V, 0.13-μm, all-layer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like phase-locked loops (PLLs) for clocking and a dedicated double data rate (DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory requirements, Cyclone devices are a cost-effective solution for data-path applications. Cyclone devices support various I/O standards, including LVDS at data rates up to 640 megabits per second (Mbps), and 66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI), for interfacing with and supporting ASSP and ASIC devices. Altera also offers new low-cost serial configuration devices to configure Cyclone devices. Features The Cyclone device family offers the following features: ■ 2,910 to 20,060 LEs, see Table 1–1 ■ Up to 294,912 RAM bits (36,864 bytes) ■ Supports configuration through low-cost serial configuration device ■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards ■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard ■ High-speed (640 Mbps) LVDS I/O support ■ Low-speed (311 Mbps) LVDS I/O support ■ 311-Mbps RSDS I/O support ■ Up to two PLLs per device provide clock multiplication and phase shifting ■ Up to eight global clock lines with six clock resources available per logic array block (LAB) row ■ Support for external memory, including DDR SDRAM (133 MHz), FCRAM, and single data rate (SDR) SDRAM ■ Support for multiple intellectual property (IP) cores, including Altera® MegaCore® functions and Altera Megafunctions Partners Program (AMPPSM) megafunctions. Chip Altera Cyclone naming rules,Chinese chip Will replace it |
8411
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240-BFQFP
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Arria II GX Field Programmable Gate Array (FPGA) IC 612 10177536 181165 1152-BBGA, FCBGA
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6971
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1152-BBGA, FCBGA
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 40K Logic Elements 800MHz 672-UBGA (23x23)
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8420
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672-FBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA
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1869
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1932-BBGA, FCBGA
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Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 325 1161216 39600 484-BGA Operating Conditions When Intel Cyclone 10 LP devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Intel Cyclone 10 LP devices, you must consider the operating requirements described in this document. Intel Cyclone 10 LP devices are offered in commercial, industrial, extended industrial and, automotive grades as follows: • –6 (fastest) and –8 speed grades for commercial devices • –7 and –8 speed grades for industrial devices • –7 speed grade for automotive devices Intel Cyclone 10 LP devices are offered in the following core voltages: • Lower core voltage option (1.0 V)—"Z": For –I8 speed grade • Standard core voltage option (1.2 V)—"Y": For –C6, –C8, –I7, and –A7 speed grades A prefix associated with the operating temperature range is attached to the speed grades: • Commercial with a "C" prefix: –C6, –C8 • Industrial with an "I" prefix: –I7, –I8 • Automotive with an "A" prefix: –A7 Chip Altera Cyclone naming rules,Chinese chip Will replace it |
1145
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484-BGA
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IC CPLD 440MC 9NS 144TQFP
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5456
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144-LQFP
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 25K Logic Elements 700MHz 672-UBGA (23x23)
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6240
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672-FBGA
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Stratix® V E Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA
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7217
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1517-BBGA, FCBGA
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Cyclone® II Field Programmable Gate Array (FPGA) IC 322 483840 33216 484-BGA Introduction Following the immensely successful first-generation Cyclone® device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements (LEs) and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric process to ensure rapid availability and low cost. By minimizing silicon area, Cyclone II devices can support complex digital systems on a single chip at a cost that rivals that of ASICs. Unlike other FPGA vendors who compromise power consumption and performance for low-cost, Altera’s latest generation of low-cost FPGAs—Cyclone II FPGAs, offer 60% higher performance and half the power consumption of competing 90-nm FPGAs. The low cost and optimized feature set of Cyclone II FPGAs make them ideal solutions for a wide array of automotive, consumer,communications, video processing, test and measurement, and other end-market solutions. Reference designs, system diagrams, and IP, found at www.altera.com, are available to help you rapidly develop complete end-market solutions using Cyclone II FPGAs. Low-Cost Embedded Processing Solutions Cyclone II devices support the Nios II embedded processor which allows you to implement custom-fit embedded processing solutions. Cyclone II devices can also expand the peripheral set, memory, I/O, or performance of embedded processors. Single or multiple Nios II embedded processors can be designed into a Cyclone II device to provide additional co-processing power or even replace existing embedded processors in your system. Using Cyclone II and Nios II together allow for low-cost, high-performance embedded processing solutions, which allow you to extend your product's life cycle and improve time to market over standard product solutions. Low-Cost DSP Solutions Use Cyclone II FPGAs alone or as DSP co-processors to improve price-to-performance ratios for digital signal processing (DSP) applications. You can implement high-performance yet low-cost DSP systems with the following Cyclone II features and design support: ■ Up to 150 18 × 18 multipliers ■ Up to 1.1 Mbit of on-chip embedded memory ■ High-speed interfaces to external memory ■ DSP intellectual property (IP) cores ■ DSP Builder interface to The Mathworks Simulink and Matlab design environment ■ DSP Development Kit, Cyclone II Edition Cyclone II devices include a powerful FPGA feature set optimized for low-cost applications including a wide range of density, memory, embedded multiplier, and packaging options. Cyclone II devices support a wide range of common external memory interfaces and I/O protocols required in low-cost applications. Parameterizable IP cores from Altera and partners make using Cyclone II interfaces and protocols fast and easy Features The Cyclone II device family offers the following features: ■ High-density architecture with 4,608 to 68,416 LEs ● M4K embedded memory blocks ● Up to 1.1 Mbits of RAM available without reducing available logic ● 4,096 memory bits per block (4,608 bits per block including 512 parity bits) ● Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36 ● True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes ● Byte enables for data input masking during writes ● Up to 260-MHz operation ■ Embedded multipliers ● Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance ● Optional input and output registers ■ Advanced I/O support ● High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL ● Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL ● Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces ● PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function ● 133-MHz PCI-X 1.0 specification compatibility ● High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use ● Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register ● Programmable bus-hold feature ● Programmable output drive strength feature ● Programmable delays from the pin to the IOE or logic array ● I/O bank grouping for unique VCCIO and/or VREF bank settings ● MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces ● Hot-socketing operation support ● Tri-state with weak pull-up on I/O pins before and during configuration ● Programmable open-drain outputs ● Series on-chip termination support ■ Flexible clock management circuitry ● Hierarchical clock network for up to 402.5-MHz performance ● Up to four PLLs per device provide clock multiplication and division, phase shifting, programmable duty cycle, and external clock outputs, allowing system-level clock management and skew control ● Up to 16 global clock lines in the global clock network that drive throughout the entire device ■ Device configuration ● Fast serial configuration allows configuration times less than 100 ms ● Decompression feature allows for smaller programming file storage and faster configuration times ● Supports multiple configuration modes: active serial, passive serial, and JTAG-based configuration ● Supports configuration through low-cost serial configuration devices ● Device configuration supports multiple voltages (either 3.3, 2.5, or 1.8 V) ■ Intellectual property ● Altera megafunction and Altera MegaCore function support, and Altera Megafunctions Partners Program (AMPPSM) megafunction support, for a wide range of embedded processors, on-chip and off-chip interfaces, peripheral functions, DSP functions, and communications functions and protocols. Visit the Altera IPMegaStore at www.altera.com to download IP MegaCore functions. ● Nios II Embedded Processor support The Cyclone II family offers devices with the Fast-On feature, which offers a faster power-on-reset (POR) time. Devices that support the Fast-On feature are designated with an “A” in the device ordering code.For example, EP2C5A, EP2C8A, EP2C15A, and EP2C20A. The EP2C5A is only available in the automotive speed grade. The EP2C8A and EP2C20A are only available in the industrial speed grade. The EP2C15A is only available with the Fast-On feature and is available in both commercial and industrial grades. The Cyclone II “A” devices are identical in feature set and functionality to the non-A devices except for support of the faster POR time. Cyclone II A devices are offered in automotive speed grade. For more information, refer to the Cyclone II section in the Automotive-Grade Device Handbook. For more information on POR time specifications for Cyclone II A and non-A devices, refer to the Hot Socketing & Power-On Reset chapter in the Cyclone II Device Handbook. Table 1–1 lists the Cyclone II device family features. Table 1–2 lists the Cyclone II device package offerings and maximum user I/O pins. Chip Altera Cyclone naming rules,Chinese chip Will replace it |
56
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484-BGA
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IC CPLD 64MC 7.5NS 68MBGA
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4489
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68-TFBGA
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 40K Logic Elements 700MHz 672-UBGA (23x23)
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8603
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672-FBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA
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5699
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1517-BBGA, FCBGA
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Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 5136 144-LQFP Exposed Pad Cyclone III Device Family Overview Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants: ■ Cyclone III—lowest power, high functionality with the lowest cost ■ Cyclone III LS—lowest power FPGAs with security With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application. Cyclone III Device Family Features Cyclone III device family offers the following features: Lowest Power FPGAs ■ Lowest power consumption with TSMC low-power process technology and Altera® power-aware design flow ■ Low-power operation offers the following benefits: ■ Extended battery life for portable and handheld applications ■ Reduced or eliminated cooling system costs ■ Operation in thermally-challenged environments ■ Hot-socketing operation support Design Security Feature Cyclone III LS devices offer the following design security features: ■ Configuration security using advanced encryption standard (AES) with 256-bit volatile key ■ Routing architecture optimized for design separation flow with the Quartus® II software ■ Design separation flow achieves both physical and functional isolation between design partitions ■ Ability to disable external JTAG port ■ Error Detection (ED) Cycle Indicator to core ■ Provides a pass or fail indicator at every ED cycle ■ Provides visibility over intentional or unintentional change of configuration random access memory (CRAM) bits ■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM, embedded memory, and AES key ■ Internal oscillator enables system monitor and health check capabilities Chip Altera Cyclone naming rules,Chinese chip Will replace it |
2937
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144-LQFP Exposed Pad
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IC CPLD 128MC 7.5NS 100MBGA
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4892
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100-TFBGA
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Automotive, AEC-Q100, Cyclone® V SE FPGA - 25K Logic Elements 700MHz 672-UBGA (23x23)
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2651
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672-FBGA
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Stratix® V GS Field Programmable Gate Array (FPGA) IC 432 13312000 236000 1152-BBGA, FCBGA
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3346
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1152-BBGA, FCBGA
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Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA Cyclone III Device Family Overview Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants: ■ Cyclone III—lowest power, high functionality with the lowest cost ■ Cyclone III LS—lowest power FPGAs with security With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application. Cyclone III Device Family Features Cyclone III device family offers the following features: Lowest Power FPGAs ■ Lowest power consumption with TSMC low-power process technology and Altera® power-aware design flow ■ Low-power operation offers the following benefits: ■ Extended battery life for portable and handheld applications ■ Reduced or eliminated cooling system costs ■ Operation in thermally-challenged environments ■ Hot-socketing operation support Design Security Feature Cyclone III LS devices offer the following design security features: ■ Configuration security using advanced encryption standard (AES) with 256-bit volatile key ■ Routing architecture optimized for design separation flow with the Quartus® II software ■ Design separation flow achieves both physical and functional isolation between design partitions ■ Ability to disable external JTAG port ■ Error Detection (ED) Cycle Indicator to core ■ Provides a pass or fail indicator at every ED cycle ■ Provides visibility over intentional or unintentional change of configuration random access memory (CRAM) bits ■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM, embedded memory, and AES key ■ Internal oscillator enables system monitor and health check capabilities Chip Altera Cyclone naming rules,Chinese chip Will replace it |
1325
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324-BGA
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IC CPLD 440MC 9NS 100TQFP
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5188
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100-TQFP
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Arria V GX Field Programmable Gate Array (FPGA) IC 544 15470592 242000 1152-BBGA, FCBGA Exposed Pad
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9677
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1152-BBGA, FCBGA Exposed Pad
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Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA
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5958
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1517-BBGA, FCBGA
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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 292 2810880 75408 484-BGA Operating Conditions When Cyclone IV devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Cyclone IV devices, you must consider the operating requirements described in this chapter. Cyclone IV devices are offered in commercial, industrial, extended industrial and, automotive grades. Cyclone IV E devices offer –6 (fastest), –7, –8, –8L, and –9L speed grades for commercial devices, –8L speed grades for industrial devices, and –7 speed grade for extended industrial and automotive devices. Cyclone IV GX devices offer –6 (fastest), –7, and –8 speed grades for commercial devices and –7 speed grade for industrial devices. Cyclone IV E devices are offered in core voltages of 1.0 and 1.2 V. Cyclone IV E devices with a core voltage of 1.0 V have an ‘L’ prefix attached to the speed grade. In this chapter, a prefix associated with the operating temperature range is attached to the speed grades; commercial with a “C” prefix, industrial with an “I” prefix, and automotive with an “A” prefix. Therefore, commercial devices are indicated as C6, C7, C8, C8L, or C9L per respective speed grade. Industrial devices are indicated as I7, I8, or I8L. Automotive devices are indicated as A7. Cyclone IV E industrial devices I7 are offered with extended operating temperature range. Chip Altera Cyclone naming rules,Chinese chip Will replace it |
4567
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484-BGA
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IC CPLD 980MC 6.2NS 324FBGA
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4127
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324-LBGA
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 25K Logic Elements 800MHz 672-UBGA (23x23)
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5258
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672-FBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA
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8374
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1152-BBGA, FCBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 1105920 29440 169-LBGA Introduction The CycloneTM field programmable gate array family is based ona 1.5-V, 0.13-um, alayer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like phase- locked loops (PLLs) for clocking and a dedicated double data rate (DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory requirements, Cyclone devices are a cost effective solution for data-path applications. Cyclone devices support various I/O standards, including LVDS at data rates up to 311 megabits per second (Mbps) and 66-MHz, 32-bit peripheral component interconnect (PCI), for interfacing with and supporting ASSP and ASIC devices. Altera also offers new low-cost serial configuration devices to configure Cyclone devices. Features ■Up to 294,912 RAM bits (36,864 bytes) ■Supports configuration through low-cost serial configuration device ■Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards ■Support for 66-MHz, 32-bit PCI standard ■Low speed (311 Mbps) LVDS 1/O support ■Up to two PLLs per device provide clock multiplication and phase shifting ■Up to eight global clock lines with six clock resources available per logic array block (LAB) row ■Support for external memory, induding DDR SDRAM (133 MHz), FCRAM, and single data rate (SDR) SDRAM ■Support for multiple intellectual property (IP) cores, including Altera" MegaCore functions and Altera Megafunctions Partners Program (AMPPSM) megafunctions Chip Altera Cyclone naming rules,Chinese chip Will replace it |
6032
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169-LBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 4257792 73920 484-BGA
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2559
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484-BGA
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Cyclone® III Field Programmable Gate Array (FPGA) IC 106 423936 5136 164-TFBGA
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8618
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164-TFBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA
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2589
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1517-BBGA, FCBGA
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