FIRST ORDER
FREE 10% DISCOUNT
Img
|
Pdf
|
Part Number
|
Manufacturers
|
Desc
|
In Stock
|
Packing
|
Rfq
|
||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Linear Voltage Regulator IC Positive Fixed 1 Output 3A TO-220, Power
|
3381
|
TO-220-3
|
|
||||||||||||||||||||||||||
Zener Diode 5.1 V 2 W ±2% Surface Mount SMBJ (DO-214AA)
|
8655
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
Bipolar (BJT) Transistor
|
1825
|
-
|
|
||||||||||||||||||||||||||
Converter Offline Topology 100Hz ~ 500kHz 8-SOIC
|
9953
|
-
|
|
||||||||||||||||||||||||||
Zener Diode 11 V 2 W ±2% Surface Mount SMBJ (DO-214AA)
|
7436
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
Bipolar (BJT) Transistor
|
9517
|
|
|||||||||||||||||||||||||||
Boost, Buck, Flyback, Forward Regulator Positive, Isolation Capable Output Step-Up, Step-Down DC-DC Controller IC 14-SOIC
|
4829
|
14-SOIC (0.154", 3.90mm Width)
|
|
||||||||||||||||||||||||||
Zener Diode 24 V 2 W ±2% Surface Mount SMBJ (DO-214AA)
|
4570
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
IGLOO Field Programmable Gate Array (FPGA) IC 49 768 68-VFQFN Exposed Pad General Description The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. The Flash*Freeze technology used in IGLOO devices enables entering and exiting an ultra-low power mode that consumes as little as 5 μW while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management with rapid recovery to operation mode. The Low Power Active capability (static idle) allows for ultra-low power consumption (from 12 μW) while the IGLOO device is completely functional in the system. This allows the IGLOO device to control system power management based on external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power. Nonvolatile flash technology gives IGLOO devices the advantage of being a secure, low power, single-chip solution that is Instant On. IGLOO is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. IGLOO devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The AGL015 and AGL030 devices have no PLL or RAM support. IGLOO devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. M1 IGLOO devices support the high-performance, 32-bit Cortex-M1 processor developed by ARM for implementation in FPGAs. Cortex-M1 is a soft processor that is fully implemented in the FPGA fabric. It has a three-stage pipeline that offers a good balance between low power consumption and speed when implemented in an M1 IGLOO device. The processor runs the ARMv6-M instruction set, has a configurable nested interrupt controller, and can be implemented with or without the debug block. Cortex-M1 is available for free from Microsemi for use in M1 IGLOO FPGAs. The ARM-enabled devices have ordering numbers that begin with M1AGL and do not support AES decryption. Features and Benefits
1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 μW Power Consumption in Flash*Freeze Mode Low Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power Consumption while MaintainingFPGA Content Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
15K to 1 Million System Gates Up to 144 Kbits of True Dual-Port SRAM Up to 300 User 1/Os
130-nm, 7-Layer Metal, Flash-Based CMOS Process Instant On Level 0 Support Single-Chip Solution Retains Programmed Design When Powered Off 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance
ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled IGLOO®devices) via JTAG (IEEE 1532-compliant) FlashLock®Designed to Secure FPGA Contents
Segmented, Hierarchical Routing and Clock Structure
700 Mbps DDR,LVDS-Capable I/Os (AGL250 and above) 1.2 V, 1.5 V, 1.8 V, 2.5V, and 3.3 V Mixed-Voltage Operation Bank-Selectable I/O Voltages--up to 4 Banks per Chip Single-Ended I/O Standards:LVTTL,LVCMOS 3.3V/2.5 V/ 1.8 V /1.5 V/ 1.2 .V, 3.3 V PCI/ 3.3 V PCI-X, and LVCMOS 2.5 V/5.0V Input DifferentialI/O Standards:LVPECL,LVDS,B-LVDS,and M-LVDS (AGL250 and above) Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575V I/O Registers on Input, Output, and Enable Paths Hot-Swappable and Cold-Sparing,I/Os+ Programmable Output Slew Rateand Drive Strength Weak Pull-Up/-Down IEEE 1149.1 (JTAG) Boundary Scan Test Pin-Compatible Packages across the IGLOO Family
Six CCC Blocks, One with an Integrated PLL Configurable Phase Shift, Multiply/Divide,Delay Capabilities, and External Feedback Wide Input Frequency Range (1.5 MHz up to 250 MHz)
1 kbit of FlashROM User Nonvolatile Memory SRAMs and FIFOs with Variable-Aspect-Ratio4,608-Bit RAM Blocks (x1,x2,x4, x9, and x18 organizations) True Dual-Port SRAM (except x18)
M1 IGLOO Devices--Cortex®-M1 Soft Processor Available with or without Debug How to choose FPGA for your project?
|
4897
|
68-VFQFN Exposed Pad
|
|
||||||||||||||||||||||||||
Power Supply Controller Secondary-Side Controller 8-CDIP
|
4692
|
8-CDIP (0.300", 7.62mm)
|
|
||||||||||||||||||||||||||
Zener Diode 51 V 2 W ±2% Surface Mount SMBJ (DO-214AA)
|
7763
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
IGLOO Field Programmable Gate Array (FPGA) IC 71 36864 3072 100-TQFP General Description The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution, small footprint packages, reprogrammability, and an abundance of advanced features. The Flash*Freeze technology used in IGLOO devices enables entering and exiting an ultra-low power mode that consumes as little as 5 μW while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management with rapid recovery to operation mode. The Low Power Active capability (static idle) allows for ultra-low power consumption (from 12 μW) while the IGLOO device is completely functional in the system. This allows the IGLOO device to control system power management based on external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power. Nonvolatile flash technology gives IGLOO devices the advantage of being a secure, low power, single-chip solution that is Instant On. IGLOO is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. IGLOO devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The AGL015 and AGL030 devices have no PLL or RAM support. IGLOO devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. M1 IGLOO devices support the high-performance, 32-bit Cortex-M1 processor developed by ARM for implementation in FPGAs. Cortex-M1 is a soft processor that is fully implemented in the FPGA fabric. It has a three-stage pipeline that offers a good balance between low power consumption and speed when implemented in an M1 IGLOO device. The processor runs the ARMv6-M instruction set, has a configurable nested interrupt controller, and can be implemented with or without the debug block. Cortex-M1 is available for free from Microsemi for use in M1 IGLOO FPGAs. The ARM-enabled devices have ordering numbers that begin with M1AGL and do not support AES decryption. Features and Benefits
1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 μW Power Consumption in Flash*Freeze Mode Low Power Active FPGA Operation Flash*Freeze Technology Enables Ultra-Low Power Consumption while MaintainingFPGA Content Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
15K to 1 Million System Gates Up to 144 Kbits of True Dual-Port SRAM Up to 300 User 1/Os
130-nm, 7-Layer Metal, Flash-Based CMOS Process Instant On Level 0 Support Single-Chip Solution Retains Programmed Design When Powered Off 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance
ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled IGLOO®devices) via JTAG (IEEE 1532-compliant) FlashLock®Designed to Secure FPGA Contents
Segmented, Hierarchical Routing and Clock Structure
700 Mbps DDR,LVDS-Capable I/Os (AGL250 and above) 1.2 V, 1.5 V, 1.8 V, 2.5V, and 3.3 V Mixed-Voltage Operation Bank-Selectable I/O Voltages--up to 4 Banks per Chip Single-Ended I/O Standards:LVTTL,LVCMOS 3.3V/2.5 V/ 1.8 V /1.5 V/ 1.2 .V, 3.3 V PCI/ 3.3 V PCI-X, and LVCMOS 2.5 V/5.0V Input DifferentialI/O Standards:LVPECL,LVDS,B-LVDS,and M-LVDS (AGL250 and above) Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575V I/O Registers on Input, Output, and Enable Paths Hot-Swappable and Cold-Sparing,I/Os+ Programmable Output Slew Rateand Drive Strength Weak Pull-Up/-Down IEEE 1149.1 (JTAG) Boundary Scan Test Pin-Compatible Packages across the IGLOO Family
Six CCC Blocks, One with an Integrated PLL Configurable Phase Shift, Multiply/Divide,Delay Capabilities, and External Feedback Wide Input Frequency Range (1.5 MHz up to 250 MHz)
1 kbit of FlashROM User Nonvolatile Memory SRAMs and FIFOs with Variable-Aspect-Ratio4,608-Bit RAM Blocks (x1,x2,x4, x9, and x18 organizations) True Dual-Port SRAM (except x18)
M1 IGLOO Devices--Cortex®-M1 Soft Processor Available with or without Debug How to choose FPGA for your project?
|
7199
|
100-TQFP
|
|
||||||||||||||||||||||||||
Zener Diode 1.8 V 1 W ±5% Surface Mount DO-216AA
|
4014
|
DO-216AA
|
|
||||||||||||||||||||||||||
Zener Diode 3.3 V 5 W ±5% Surface Mount SMBJ (DO-214AA)
|
1945
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
ProASIC3L Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP Clock Frequency Synthesis Deriving clocks of various frequencies from a single reference clock is known as frequency synthesis.The PLL has an input frequency range from 1.5 to 350 MHz. This frequency is automatically divideddown to a range between 1.5 MHz and 5.5 MHz by input dividers (not shown in Figure 4-19 on page 100)between PLL macro inputs and PLL phase detector inputs. The VCO output is capable of an outputrange from 24 to 350 MHz. With dividers before the input to the PLL core and following the VCO outputs,the VCO output frequency can be divided to provide the final frequency range from 0.75 to 350 MHz.Using SmartGen, the dividers are automatically set to achieve the closest possible matches to thespecified output frequencies. Users should be cautious when selecting the desired PLL input and output frequencies and the I/O bufferstandard used to connect to the PLL input and output clocks. Depending on the I/O standards used forthe PLL input and output clocks, the I/O frequencies have different maximum limits. Refer to the familydatasheets for specifications of maximum I/O frequencies for supported I/O standards. Desired PLL inputor output frequencies will not be achieved if the selected frequencies are higher than the maximum I/Ofrequencies allowed by the selected I/O standards. Users should be careful when selecting the I/Ostandards used for PLL input and output clocks. Performing post-layout simulation can help detect thistype of error, which will be identified with pulse width violation errors. Users are strongly encouraged toperform post-layout simulation to ensure the I/O standard used can provide the desired PLL input oroutput frequencies. Users can also choose to cascade PLLs together to achieve the high frequenciesneeded for their applications. Details of cascading PLLs are discussed in the "Cascading CCCs" sectionon page 125. In SmartGen, the actual generated frequency (under typical operating conditions) will be displayedbeside the requested output frequency value. This provides the ability to determine the exact frequencythat can be generated by SmartGen, in real time. The log file generated by SmartGen is a useful tool indetermining how closely the requested clock frequencies match the user specifications. For example,assume a user specifies 101 MHz as one of the secondary output frequencies. If the best outputfrequency that could be achieved were 100 MHz, the log file generated by SmartGen would indicate theactual generated frequency How to choose FPGA for your project?
|
6617
|
100-TQFP
|
|
||||||||||||||||||||||||||
IGBT PT 1200 V 41 A 250 W Through Hole TO-220 [K]
|
7970
|
TO-220-3
|
|
||||||||||||||||||||||||||
Zener Diode 4.3 V 5 W ±5% Surface Mount SMBJ (DO-214AA)
|
7418
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
ProASIC3 Field Programmable Gate Array (FPGA) IC 194 55296 484-BGA General Description ProASIC3,the third-generation family of Microsemi flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3 devices the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools. ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os. ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption. Features and Benefits
15 K to 1 M System Gates Up to 144 Kbits of True Dual-Port SRAM Up to 300 User I/Os
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process Instant On Level 0 Support Single-Chip Solution Retains Programmed Design when Powered Off
350 MHz System Performance 3.3 V, 66 MHz 64-Bit PCI
ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532-compliant) FlashLock® to Secure FPGA Contents
Core Voltage for Low Power Support for 1.5V-Only Systems Low-Impedance Flash Switches
Segmented, Hierarchical Routing and Clock Structure
700 Mbps DDR,LVDS-Capable I/Os (A3P250 and above) 1.5V, 1.8 V, 2.5 V,and 3.3V Mixed-Voltage Operation Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V Bank-Selectable I/O Voltages—up to 4 Banks per Chip Single-Ended I/O Standards: LVTTL, LVCMOS 3.3V / 2.5V / 1.8V / 1.5V, 3.3V PCI / 3.3V PCI-X and LVCMOS 2.5V / 5.0V Input Differential I/O Standards: LVPECL,LVDS,B-LVDS, and M-LVDS (A3P250 and above) I/O Registers on Input, Output, and Enable Paths Hot-Swappable and Cold Sparing I/Os Programmable Output Slew Rate and Drive Strength Weak Pull-Up/-Down IEEE 1149.1 (JTAG) Boundary Scan Test Pin-Compatible Packages across the ProASIC3 Family
Six CCC Blocks, One with an Integrated PLL Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback Wide Input Frequency Range (1.5 MHz to 350 MHz)
1 Kbit of FlashROM User Nonvolatile Memory SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (x1, x2, x4, x9, and x18 organizations) True Dual-Port SRAM (except x18)
M1 ProASIC3 Devices-ARM®Cortex®-M1 Soft Processor Available with or without Debug How to choose FPGA for your project?
|
7231
|
484-BGA
|
|
||||||||||||||||||||||||||
N-Channel 800 V 17A (Tc) 208W (Tc) Surface Mount D3Pak
|
8258
|
TO-268-3, D³Pak (2 Leads + Tab), TO-268AA
|
|
||||||||||||||||||||||||||
Zener Diode 5.6 V 5 W ±2% Surface Mount SMBJ (DO-214AA)
|
7258
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
Diode Array 2 Independent 300 V 60A Chassis Mount SOT-227-4, miniBLOC
|
5351
|
SOT-227-4, miniBLOC
|
|
||||||||||||||||||||||||||
Zener Diode 140 V 5 W ±5% Surface Mount SMBJ (DO-214AA)
|
9337
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
N-Channel 400 V 57A (Tc) 520W (Tc) Through Hole TO-264 [L]
|
8398
|
TO-264-3, TO-264AA
|
|
||||||||||||||||||||||||||
Zener Diode 4.3 V 2 W ±10% Surface Mount SMBJ (DO-214AA)
|
2302
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
N-Channel 600 V 55A (Tc) 568W (Tc) Chassis Mount ISOTOP®
|
4676
|
SOT-227-4, miniBLOC
|
|
||||||||||||||||||||||||||
Zener Diode 110 V 2 W ±2% Surface Mount SMBJ (DO-214AA)
|
4436
|
DO-214AA, SMB
|
|
||||||||||||||||||||||||||
Zener Diode 82 V 1 W ±5% Through Hole DO-204AL (DO-41)
|
1857
|
DO-204AL, DO-41, Axial
|
|
||||||||||||||||||||||||||
RF Diode PIN - Single 50V 2.5 W DO-216
|
6189
|
DO-216AA
|
|
||||||||||||||||||||||||||
Zener Diode 6.2 V 5 W ±5% Through Hole T-18
|
5307
|
T-18, Axial
|
|
||||||||||||||||||||||||||
Zener Diode 110 V 1 W ±2% Through Hole DO-204AL (DO-41)
|
2331
|
DO-204AL, DO-41, Axial
|
|
||||||||||||||||||||||||||