A Comprehensive Guide To ICE40LP384-SG32 iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed Pad - Lattice Semiconductor Corporation components - ICONE-chip,IntegrationCircuit , Semiconductor Distributors, IC Chips
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A Comprehensive Guide To ICE40LP384-SG32 iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed Pad

  • Manufacturer: Lattice Semiconductor Corporation
  • Product NO: ICE40LP384-SG32
  • Package: 32-VFQFN Exposed Pad
  • Stock: 11
  • Sample Price: $2.15
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  • Description: iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed PadGeneral DescriptionThe iCE40 family of ul
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iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed Pad


General Description

The iCE40 family of ultra-low power, non-volatile FPGAs has five devices with densities ranging from 384 to 7680Look-Up

Tables (LUTs). In addition to LUT-based, low-cost programmable logic, these devices feature EmbeddedBlock RAM (EBR),

Non-volatile Configuration Memory (NVCM) and Phase Locked Loops (PLLs). These featuresallow the devices to be used

in low-cost, high-volume consumer and system applications. Select packages offerHigh-Current drivers that are ideal to

drive three white LEDs, or one RGB LED.

The iCE40 devices are fabricated on a 40 nm CMOS low power process. The device architecture has several features such

as programmable low-swing differential I/Os and the ability to turn off on-chip PLLs dynamically. Thesefeatures help

manage static and dynamic power consumption, resulting in low static power for all members of thefamily. The iCE40

devices are available in two versions – ultra low power (LP) and high performance (HX) devices.

The iCE40 FPGAs are available in a broad range of advanced halogen-free packages ranging from the spacesaving

1.40x1.48 mm WLCSP to the PCB-friendly 20x20 mm TQFP. Table 1-1 shows the LUT densities, packageand I/O options,

along with other key parameters.

The iCE40 devices offer enhanced I/O features such as pull-up resistors. Pull-up features are controllable on a“per-pin”

basis.

The iCE40 devices also provide flexible, reliable and secure configuration from on-chip NVCM. These devices canalso

configure themselves from external SPI Flash or be configured by an external master such as a CPU.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the iCE40family

of devices. Popular logic synthesis tools provide synthesis library support for iCE40. Lattice design tools usethe synthesis

tool output along with the user-specified preferences and constraints to place and route the design inthe iCE40 device.

These tools extract the timing from the routing and back-annotate it into the design for timing ver-ification.

Lattice provides many pre-engineered IP (Intellectual Property) modules, including a number of reference designs,licensed

free of charge, optimized for the iCE40 FPGA family. By using these configurable soft core IP cores asstandardized blocks,

users are free to concentrate on the unique aspects of their design, increasing their productivity.


Features

  • Flexible Logic Architecture

      Five devices with 384 to 7,680 LUT4s and10 to 206 I/Os

  • Ultra Low Power Devices

      Advanced 40 nm low power process

      As low as 21 µA standby power

      Programmable low swing differential I/Os

  • Embedded and Distributed Memory

      Up to 128 kbits sysMEM™ Embedded Block RAM

  • Pre-Engineered Source Synchronous I/O

      DDR registers in I/O cells

  • High Current LED Drivers

      Three High Current Drivers used for three differ-ent LEDs or one RGB LED

  • High Performance, Flexible I/O Buffer

      Programmable sysIO™ buffer supports wide range of interfaces:

      — LVCMOS 3.3/2.5/1.8

      — LVDS25E, subLVDS

      — Schmitt trigger inputs, to 200 mV typical hysteresis

      Programmable pull-up mode

  • Flexible On-Chip Clocking

      Eight low-skew global clock resources

      Up to two analog PLLs per device

  • Flexible Device Configuration

      SRAM is configured through:

      — Standard SPI Interface

      — Internal Nonvolatile Configuration Memory (NVCM)

  • Broad Range of Package Options

      WLCSP, QFN, VQFP, TQFP, ucBGA, caBGA, and csBGA package options

      Small footprint package options

      — As small as 1.40 mm x 1.48 mm

      Advanced halogen-free packaging


How to choose FPGA for your project?



                                                                 



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