A Comprehensive Guide To LFXP2-5E-5QN208C XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP

XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP

General Description

LatticeXP2 devices combine a Look-up Table (LUT) based FPGA fabric with non-volatile Flash cells in an architecture

referred to as flexiFLASH.

The flexiFLASH approach provides benefits including instant-on, infinite reconfigurability, on chip storage with FlashBAK

embedded block memory and Serial TAG memory and design security. The parts also support Live Update technology with

TransFR, 128-bit AES Encryption and Dual-boot technologies.

The LatticeXP2 FPGA fabric was optimized for the new technology from the outset with high performance and low cost in

mind. LatticeXP2 devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs),

pre-engineered source synchronous I/O support and enhanced sysDSP blocks.

Lattice Diamond® design software allows large and complex designs to be efficiently implemented using the LatticeXP2

family of FPGA devices. Synthesis library support for LatticeXP2 is available for popular logic synthesis tools. The Diamond

software uses the synthesis tool output along with the constraints from its floor planning tools to place and route the

design in the LatticeXP2 device. The Diamond tool extracts the timing from the routing and back-annotates it into the

design for timing verification.

Lattice provides many pre-designed Intellectual Property (IP) LatticeCORE™ modules for the LatticeXP2 family. By using

these IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their

productivity.

Features

• flexiFLASH™ Architecture

      Instant-on

      Infinitely reconfigurable

      Single chip

      FlashBAK™ technology

      Serial TAG memory

      Design security

• Live Update Technology

      TransFR™ technology

      Secure updates with 128 bit AES encryption

      Dual-boot with external SPI

• sysDSP™ Block

      Three to eight blocks for high performance Multiply and Accumulate

      12 to 32 18x18 multipliers

      Each block supports one 36x36 multiplier or four 18x18 or eight 9x9 multipliers

• Embedded and Distributed Memory

      Up to 885 Kbits sysMEM™ EBR

      Up to 83 Kbits Distributed RAM

• sysCLOCK™ PLLs

      Up to four analog PLLs per device

      Clock multiply, divide and phase shifting

• Flexible I/O Buffer

      sysIO™ buffer supports:

            – LVCMOS 33/25/18/15/12; LVTTL

            – SSTL 33/25/18 class I, II

            – HSTL15 class I; HSTL18 class I, II

            – PCI

            – LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS

• Pre-engineered Source SynchronousInterfaces

      DDR / DDR2 interfaces up to 200 MHz

      7:1 LVDS interfaces support display applications

      XGMII

• Density And Package Options

      5k to 40k LUT4s, 86 to 540 I/Os

      csBGA, TQFP, PQFP, ftBGA and fpBGA packages

      Density migration supported

• Flexible Device Configuration

      SPI (master and slave) Boot Flash Interface

      Dual Boot Image supported

      Soft Error Detect (SED) macro embedded

• System Level Support

      IEEE 1149.1 and IEEE 1532 Compliant

      On-chip oscillator for initialization & general use

      Devices operate with 1.2V power supply

How to choose FPGA for your project?

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