A Comprehensive Guide To S9S12ZVLS3F0MFMR Microcontroller IC 16-Bit 32MHz 32KB (32K x 8) FLASH 32-HVQFN (5x5)

S12Z S12 MagniV Microcontroller IC 16-Bit 32MHz 32KB (32K x 8) FLASH 32-HVQFN (5x5)

Introduction

The MC9S12ZVL-Family is an automotive 16-bit microcontroller family using the 180nm NVM +UHV

technology that offers the capability to integrate 40V analog components. This family reuses many

features from the existing S12 portfolio. The particular differentiating features of this family are the

enhanced S12Z core and the integration of“high-voltage”analog modules, including the voltage regulator

(VREG) and a Local Interconnect Network (LIN) physical layer.

The MC9S12ZVL-Family includes error correction code (ECC) on RAM, FLASH and EEPROM for

diagnostic or data storage, a fast analog-to-digital converter (ADC) and a frequency modulated phase

locked loop (IPLL) that improves the EMC performance. The MC9S12ZVL-Family delivers an optimized

solution with the integration of several key system components into a single device, optimizing system

architecture and achieving significant space savings. The MC9S12ZVL-Family delivers all the advantages

and efficiencies of a 16-bit MCU while retaining the low cost, power consumption, EMC, and code-size

efficiency advantages currently enjoyed by users of existing S12 families. The MC9S12ZVL-Family is

available in 48-pin, 32-pin LQFPand 32-pin QFN-EP. In addition to the I/O ports available in each

module, further I/O ports are available with interrupt capability allowing wake-up from stop or wait

modes.

The MC9S12ZVL-Family is a general-purpose family of devices suitable for a wide range ofapplications.

The MC9S12ZVL-Family is targeted at generic automotive applications requiring LIN connectivity.

Typical examples of these applications include switch panels and body endpoints for sensors.

Chip-Level Features

On-chip modules available within the family include the following features:

•S12Z CPU core 

•128, 96, 64, 32, 16 or 8 KB on-chip flash with ECC

•2048, 1024, 128 byte EEPROM with ECC

•8192, 4096, 1024 or 512 byte on-chip SRAM with ECC

•Phase locked loop (IPLL) frequency multiplier with internal filter

•1 MHz internal RC oscillator with +/-1.3% accuracy over rated temperature range

•4-20 MHz amplitude controlled pierce oscillator

•Internal COP (watchdog) module 

•analog-to-digital converter (ADC) with 10 -bit or 12 -bit resolution and up to 10 channels available 

 on external pins and Vbg (bandgap) result reference

•PGA module with two input channels

•One 8-bit 5V digital-to-analog converter (DAC)

•One analog comparators (ACMP) with rail-to-rail inputs

•MSCAN (1 Mbit/s, CAN 2.0 A, B software compatible) module

•One serial peripheral interface (SPI) module

•One serial communication interface (SCI) module with interface to internal LIN physical layer 

 transceiver (with RX connected to a timer channel for frequency calibration purposes, if desired)

•Up to one additional SCI (not connected to LIN physical layer)

•One on-chip LIN physical layer transceiver fully compliant with the LIN 2.2 standard

•6-channel timer module (TIM0) with input capture/output compare

•2-channel timer module (TIM1) with input capture/output compare

•Inter-IC (IIC) module

•8-channel Pulse Width Modulation module (PWM)

•On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages

•Autonomous periodic interrupt (API), supports cyclic wakeup from Stop mode

•Pins to support 25 mA drive strength to VSSX

•Pin to support 20 mA drive strength from VDDX (EVDD)

•High Voltage Input (HVI)

•Supply voltage sense with low battery warning

•On-chip temperature sensor, temperature value can be measured with ADC or can generate a high 

 temperature warning

•Up to 23 pins can be used as keyboard wake-up interrupt (KWI)

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