Intel

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

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Cyclone® Field Programmable Gate Array (FPGA) IC 104 59904 2910 144-LQFP

Introduction

The Cyclone® field programmable gate array family is based on a 1.5-V,

0.13-μm, all-layer copper SRAM process, with densities up to

20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like

phase-locked loops (PLLs) for clocking and a dedicated double data rate

(DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM)

memory requirements, Cyclone devices are a cost-effective solution for

data-path applications. Cyclone devices support various I/O standards,

including LVDS at data rates up to 640 megabits per second (Mbps), and

66- and 33-MHz, 64- and 32-bit peripheral component interconnect (PCI),

for interfacing with and supporting ASSP and ASIC devices. Altera also

offers new low-cost serial configuration devices to configure Cyclone

devices.

Features

The Cyclone device family offers the following features:

■ 2,910 to 20,060 LEs, see Table 1–1

■ Up to 294,912 RAM bits (36,864 bytes)

■ Supports configuration through low-cost serial configuration device

■ Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■ Support for 66- and 33-MHz, 64- and 32-bit PCI standard

■ High-speed (640 Mbps) LVDS I/O support

■ Low-speed (311 Mbps) LVDS I/O support

■ 311-Mbps RSDS I/O support

■ Up to two PLLs per device provide clock multiplication and phase

shifting

■ Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■ Support for external memory, including DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■ Support for multiple intellectual property (IP) cores, including

Altera® MegaCore® functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions. 

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Cyclone® 10 GX Field Programmable Gate Array (FPGA) IC 188 10907648 150000 484-BFBGA

Summary of Intel Cyclone 10 GX Features

Technology

TSMC's 20-nm process technology

Packaging

• 1.0 mm ball-pitch FineLine BGA packaging

• 0.8 mm ball-pitch Ultra FineLine BGA packaging

• Multiple devices with identical package footprints for seamless migration between different FPGA densities

• RoHS6-compliance

High-performance FPGA fabric

• Enhanced 8-input ALM with four registers

• Improved multi-track routing architecture to reduce congestion and improve compilation time

• Hierarchical core clocking architecture

• Fine-grained partial reconfiguration

Internal memory blocks

• M20K—20-Kb memory blocks with hard error correction code (ECC), cascadable

• Memory logic array block (MLAB)—640-bit memory, cascadable

Embedded Hard IP blocks

Variable-precision DSP

• Native support for signal processing precision levels from 18 x 19 to 54 x 54, cascadable

• Native support for 27 x 27 multiplier mode

• 64-bit accumulator and cascade for systolic finite impulse responses (FIRs)

• Internal coefficient memory banks

• Preadder/subtractor for improved efficiency

• Additional pipeline register to increase performance and reduce power

• Supports floating point arithmetic:

   — Perform multiplication, addition, subtraction, multiply-add,

multiply-subtract, and complex multiplication.

   — Supports multiplication with accumulation capability, cascade

summation, and cascade subtraction capability.

   — Dynamic accumulator reset control.

   — Support direct vector dot and complex multiplication chaining multiply floating point DSP blocks.

Memory controller

DDR3, DDR3L, and LPDDR3

PCI Express®

PCI Express (PCIe®) Gen2 (x1, x2, or x4) and Gen1 (x1, x2, or x4) hard IP with complete protocol stack, endpoint, and root port.

Transceiver I/O

• PCS hard IPs that support:

   — 10 Gbps Ethernet (10GbE) (1)

   — PCIe PIPE interface

   — Interlaken

   — Gbps Ethernet (GbE)

   — 6G Common Public Radio Interface (CPRI) with deterministic latency support

   — Gigabit-capable passive optical network (GPON) with fast locktime support

• 12G Serial Digital Interface (SDI)

• 8B/10B, 64B/66B, 64B/67B encoders and decoders

• Custom mode support for proprietary protocols

Core clock networks

• Up to 300 MHz fabric clocking, depending on the application:

   — 467 MHz external memory interface clocking with 1,866 Mbps DDR3 interface

   — 300 MHz LVDS interface clocking with 1.434 Gbps LVDS interface

• Global, regional, and peripheral clock networks

• Clock networks that are not used can be gated to reduce dynamic power

Phase-locked loops(PLLs)

• High-resolution fractional synthesis PLLs:

   — Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

   — Support integer mode and fractional mode

   — Fractional mode support with third-order delta-sigma modulation

• Integer PLLs:

   — Adjacent to general purpose I/Os

   — Support external memory and LVDS interfaces

FPGA General-purpose I/Os (GPIOs)

• One 3 V I/O bank supporting up to 3.0 V I/O standards

• Up to 1.434 Gbps LVDS—every pair can be configured as receiver or transmitter

• On-chip termination (OCT)

• 1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfaces using LVDS I/O or 3 V I/O banks

External Memory Interface

• Hard memory controller—DDR3, DDR3L, and LPDDR3 support

• DDR3 speeds up to 933 MHz/1,866 Mbps

Low-power serial transceivers

• Continuous operating range up to 12.5 Gbps

• Backplane support up to 6.6 Gbps

• Extended range down to 125 Mbps with oversampling

• ATX transmit PLLs with user-configurable fractional synthesis capability

• Transmitter pre-emphasis and de-emphasis

• Dynamic reconfiguration of individual transceiver channels

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced 256-bit advanced encryption standard (AES) design security with authentication

• Configuration via protocol (CvP) using PCIe Gen1 or Gen2

• Dynamic reconfiguration of the transceivers and PLLs

• Fine-grained partial reconfiguration of the core fabric

• Active Serial ×4 Interface

Power management

• Programmable Power Technology

• Intel Quartus® Prime Pro Edition integrated power analysis tool

Software and tools

• Intel Quartus Prime Pro Edition design suite

• Transceiver toolkit

• Platform Designer (Standard) system integration tool

• DSP Builder advanced blockset

• OpenCL* support

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Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 289 2810880 81264 484-FBGA

Operating Conditions

When Intel Cyclone 10 LP devices are implemented in a system, they are rated according to a set of defined parameters.

To maintain the highest possible performance and reliability of Intel Cyclone 10 LP devices, you must consider the operating

requirements described in this document. Intel Cyclone 10 LP devices are offered in commercial, industrial, extended

industrial and, automotive grades as follows:

• –6 (fastest) and –8 speed grades for commercial devices

• –7 and –8 speed grades for industrial devices

• –7 speed grade for automotive devices

Intel Cyclone 10 LP devices are offered in the following core voltages:

• Lower core voltage option (1.0 V)—"Z": For –I8 speed grade

• Standard core voltage option (1.2 V)—"Y": For –C6, –C8, –I7, and –A7 speed grades

A prefix associated with the operating temperature range is attached to the speed grades:

• Commercial with a "C" prefix: –C6, –C8

• Industrial with an "I" prefix: –I7, –I8

• Automotive with an "A" prefix: –A7

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Cyclone® II Field Programmable Gate Array (FPGA) IC 85 165888 8256 144-LQFP

Introduction

Following the immensely successful first-generation Cyclone® device

family, Altera® Cyclone II FPGAs extend the low-cost FPGA density

range to 68,416 logic elements (LEs) and provide up to 622 usable I/O

pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are

manufactured on 300-mm wafers using TSMC's 90-nm low-k dielectric

process to ensure rapid availability and low cost. By minimizing silicon

area, Cyclone II devices can support complex digital systems on a single

chip at a cost that rivals that of ASICs. Unlike other FPGA vendors who

compromise power consumption and performance for low-cost, 

Altera’s latest generation of low-cost FPGAs—Cyclone II FPGAs, offer 60% 

higher performance and half the power consumption of competing 90-nm FPGAs. 

The low cost and optimized feature set of Cyclone II FPGAs make them ideal 

solutions for a wide array of automotive, consumer,communications, video processing, 

test and measurement, and other end-market solutions. Reference designs, 

system diagrams, and IP, found at www.altera.com, are available to help

 you rapidly develop complete end-market solutions using Cyclone II FPGAs.

Low-Cost Embedded Processing Solutions

Cyclone II devices support the Nios II embedded processor which allows

you to implement custom-fit embedded processing solutions. Cyclone II

devices can also expand the peripheral set, memory, I/O, or performance

of embedded processors. Single or multiple Nios II embedded processors

can be designed into a Cyclone II device to provide additional

co-processing power or even replace existing embedded processors in

your system. Using Cyclone II and Nios II together allow for low-cost,

high-performance embedded processing solutions, which allow you to

extend your product's life cycle and improve time to market over

standard product solutions.

Low-Cost DSP Solutions

Use Cyclone II FPGAs alone or as DSP co-processors to improve

price-to-performance ratios for digital signal processing (DSP)

applications. You can implement high-performance yet low-cost DSP

systems with the following Cyclone II features and design support:

■ Up to 150 18 × 18 multipliers

■ Up to 1.1 Mbit of on-chip embedded memory

■ High-speed interfaces to external memory

■ DSP intellectual property (IP) cores

■ DSP Builder interface to The Mathworks Simulink and Matlab

design environment

■ DSP Development Kit, Cyclone II Edition

Cyclone II devices include a powerful FPGA feature set optimized for

low-cost applications including a wide range of density, memory,

embedded multiplier, and packaging options. Cyclone II devices

 support a wide range of common external memory interfaces and 

I/O protocols required in low-cost applications. Parameterizable IP cores 

from Altera and partners make using Cyclone II interfaces and protocols fast and easy

Features

The Cyclone II device family offers the following features:

■ High-density architecture with 4,608 to 68,416 LEs

● M4K embedded memory blocks

● Up to 1.1 Mbits of RAM available without reducing available

logic

● 4,096 memory bits per block (4,608 bits per block including 512

parity bits)

● Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32,

and ×36

● True dual-port (one read and one write, two reads, or two

writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes

● Byte enables for data input masking during writes

● Up to 260-MHz operation

■ Embedded multipliers

● Up to 150 18- × 18-bit multipliers are each configurable as two

independent 9- × 9-bit multipliers with up to 250-MHz

performance

● Optional input and output registers

■ Advanced I/O support

● High-speed differential I/O standard support, including LVDS,

RSDS, mini-LVDS, LVPECL, differential HSTL, and differential

SSTL

● Single-ended I/O standard support, including 2.5-V and 1.8-V,

SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI

and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-,

and 1.8-V LVTTL

● Peripheral Component Interconnect Special Interest Group (PCI

SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V

operation at 33 or 66 MHz for 32- or 64-bit interfaces

● PCI Express with an external TI PHY and an Altera PCI Express

×1 Megacore® function

● 133-MHz PCI-X 1.0 specification compatibility

● High-speed external memory support, including DDR, DDR2,

and SDR SDRAM, and QDRII SRAM supported by drop in

Altera IP MegaCore functions for ease of use

● Three dedicated registers per I/O element (IOE): one input

register, one output register, and one output-enable register

● Programmable bus-hold feature

● Programmable output drive strength feature

● Programmable delays from the pin to the IOE or logic array

● I/O bank grouping for unique VCCIO and/or VREF bank

settings

● MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and

3.3-interfaces

● Hot-socketing operation support

● Tri-state with weak pull-up on I/O pins before and during

configuration

● Programmable open-drain outputs

● Series on-chip termination support

■ Flexible clock management circuitry

● Hierarchical clock network for up to 402.5-MHz performance

● Up to four PLLs per device provide clock multiplication and

division, phase shifting, programmable duty cycle, and external

clock outputs, allowing system-level clock management and

skew control

● Up to 16 global clock lines in the global clock network that drive

throughout the entire device

■ Device configuration

● Fast serial configuration allows configuration times less than

100 ms

● Decompression feature allows for smaller programming file

storage and faster configuration times

● Supports multiple configuration modes: active serial, passive

serial, and JTAG-based configuration

● Supports configuration through low-cost serial configuration

devices

● Device configuration supports multiple voltages (either 3.3, 2.5,

or 1.8 V)

■ Intellectual property

● Altera megafunction and Altera MegaCore function support,

and Altera Megafunctions Partners Program (AMPPSM)

megafunction support, for a wide range of embedded

processors, on-chip and off-chip interfaces, peripheral

functions, DSP functions, and communications functions and 

protocols. Visit the Altera IPMegaStore at www.altera.com to

download IP MegaCore functions.

● Nios II Embedded Processor support

The Cyclone II family offers devices with the Fast-On feature, which

offers a faster power-on-reset (POR) time. Devices that support the

Fast-On feature are designated with an “A” in the device ordering code.For example, 

EP2C5A, EP2C8A, EP2C15A, and EP2C20A. The EP2C5A is only available in the automotive speed grade. 

The EP2C8A and EP2C20A are only available in the industrial speed grade. 

The EP2C15A is only available with the Fast-On feature and is available in both commercial and industrial grades. 

The Cyclone II “A” devices are identical in feature set and functionality to the non-A devices except for support of the faster POR time.

Cyclone II A devices are offered in automotive speed grade. For more

information, refer to the Cyclone II section in the Automotive-Grade Device Handbook.

For more information on POR time specifications for Cyclone II A and

non-A devices, refer to the Hot Socketing & Power-On Reset chapter in the Cyclone II Device Handbook.

Table 1–1 lists the Cyclone II device family features. Table 1–2 lists the

Cyclone II device package offerings and maximum user I/O pins.

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Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LBGA

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low

power and low cost. Based on Taiwan Semiconductor Manufacturing Company

(TSMC) low-power (LP) process technology, silicon optimizations and software

features to minimize power consumption, Cyclone III device family provides the ideal

solution for your high-volume, low-power, and cost-sensitive applications. To address

the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and

0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power

consumption, Cyclone III device family makes it easier for you to meet your power

budget. Cyclone III LS devices are the first to implement a suite of security features at

the silicon, software, and intellectual property (IP) level on a low-power and

high-functionality FPGA platform. This suite of security features protects the IP from

tampering, reverse engineering and cloning. In addition, Cyclone III LS devices

support design separation which enables you to introduce redundancy in a single

chip to reduce size, weight, and power of your application.

Cyclone III Device Family Features

Cyclone III device family offers the following features:

Lowest Power FPGAs

■ Lowest power consumption with TSMC low-power process technology and

Altera® power-aware design flow

■ Low-power operation offers the following benefits:

■ Extended battery life for portable and handheld applications

■ Reduced or eliminated cooling system costs

■ Operation in thermally-challenged environments

■ Hot-socketing operation support

Design Security Feature

Cyclone III LS devices offer the following design security features:

■ Configuration security using advanced encryption standard (AES) with 256-bit

volatile key

■ Routing architecture optimized for design separation flow with the Quartus® II

software

■ Design separation flow achieves both physical and functional isolation

between design partitions

■ Ability to disable external JTAG port

■ Error Detection (ED) Cycle Indicator to core

■ Provides a pass or fail indicator at every ED cycle

■ Provides visibility over intentional or unintentional change of configuration

random access memory (CRAM) bits

■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM,

embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

Chip Altera Cyclone naming rules，Chinese chip Will replace it

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Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 5136 256-LBGA

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low

power and low cost. Based on Taiwan Semiconductor Manufacturing Company

(TSMC) low-power (LP) process technology, silicon optimizations and software

features to minimize power consumption, Cyclone III device family provides the ideal

solution for your high-volume, low-power, and cost-sensitive applications. To address

the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and

0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power

consumption, Cyclone III device family makes it easier for you to meet your power

budget. Cyclone III LS devices are the first to implement a suite of security features at

the silicon, software, and intellectual property (IP) level on a low-power and

high-functionality FPGA platform. This suite of security features protects the IP from

tampering, reverse engineering and cloning. In addition, Cyclone III LS devices

support design separation which enables you to introduce redundancy in a single

chip to reduce size, weight, and power of your application.

Cyclone III Device Family Features

Cyclone III device family offers the following features:

Lowest Power FPGAs

■ Lowest power consumption with TSMC low-power process technology and

Altera® power-aware design flow

■ Low-power operation offers the following benefits:

■ Extended battery life for portable and handheld applications

■ Reduced or eliminated cooling system costs

■ Operation in thermally-challenged environments

■ Hot-socketing operation support

Design Security Feature

Cyclone III LS devices offer the following design security features:

■ Configuration security using advanced encryption standard (AES) with 256-bit

volatile key

■ Routing architecture optimized for design separation flow with the Quartus® II

software

■ Design separation flow achieves both physical and functional isolation

between design partitions

■ Ability to disable external JTAG port

■ Error Detection (ED) Cycle Indicator to core

■ Provides a pass or fail indicator at every ED cycle

■ Provides visibility over intentional or unintentional change of configuration

random access memory (CRAM) bits

■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM,

embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

Chip Altera Cyclone naming rules，Chinese chip Will replace it

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