Lattice Semiconductor Corporation

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 39 81920 3520 48-VFQFN Exposed Pad

General Description

iCE40 Ultra family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications,

such as smartphones, tablets and hand-held devices. The iCE40 Ultra family includes integrated SPI and I²Cblocks to

interface with virtually all mobile sensors and application processors. The iCE40 Ultra family also featurestwo on-chip

oscillators, 10 kHz and 48 MHz. The LFOSC (10 kHz) is ideal for low power function in always-on applications, while

HFOSC (48 MHz) can be used for awaken activities.

The iCE40 Ultra family also features DSP functional block to off-load Application Processor to pre-process information

sent from the mobile sensors. The embedded RGB PWM IP, with the three 24 mA constant current RGB outputs on the

iCE40 Ultra provides all the necessary logic to directly drive the service LED, without the need ofexternal MOSFET or

buffer.

The 500 mA constant current IR driver output provides a direct interface to external LED for application such asIrDA

functions. Users simply implement the modulation logic that meets his needs, and connect the IR driverdirectly to the

LED, without the need of external MOSFET or buffer. This high current IR driver can also be used asBarcode Emulation,

sending barcode information to external Barcode Reader.

The iCE40 Ultra family of devices are targeting for mobile applications to perform functions such as IrDA, ServiceLED,

Barcode Emulation, GPIO Expander, SDIO Level Shift, and other custom functions.

The iCE40 Ultra family features three device densities, from 1100 to 3520 Look Up Tables (LUTs) of logic with

programmable I/Os that can be used as either SPI/I²C interface ports or general purpose I/O’s. It also has up to 80kbits

of Block RAMs to work with user logic.

Features

• Flexible Logic Architecture

      Three devices with 1100 to 3520 LUTs

      Offered in WLCS, ucfBGA and QFN packages

• Ultra-low Power Devices

      Advanced 40 nm ultra-low power process

      As low as 71 µA standby current typical

• Embedded Memory

      Up to 80 kbits sysMEM™ Embedded Block RAM

• Two Hardened I2C Interfaces

• Two Hardened SPI Interfaces

• Two On-Chip Oscillators

      Low Frequency Oscillator – 10 kHz

      High Frequency Oscillator – 48 MHz

• 24 mA Current Drive RGB LED Outputs

      Three drive outputs in each device

      User selectable sink current up to 24 mA

• 500 mA Current Drive IR LED Output

      One IR drive output in each device

      User selectable sink current up to 500 mA

• On-chip DSP

      Signed and unsigned 8-bit or 16-bit functions

      Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC)

• Flexible On-Chip Clocking

      Eight low skew global signal resource, six can be directly driven from external pins

      One PLL with dynamic interface per device

• Flexible Device Configuration

      SRAM is configured through:

      — Standard SPI Interface

      — Internal Nonvolatile Configuration Memory (NVCM)

• Ultra-Small Form Factor

      As small as 2.078 mm x 2.078 mm

• Applications

      Smartphones

      Tablets and Consumer Handheld Devices

      Handheld Commercial and Industrial Devices

      Multi Sensor Management Applications

      Sensor Pre-processing and Sensor Fusion

      Always-On Sensor Applications

      USB 3.1 Type C Cable Detect / Power Delivery Applications